Several changes are involved since they are all interrelated. These
changes affect about 1000 files.
The first major change is rewriting bsd.builtin.mk as well as all of
the builtin.mk files to follow the new example in bsd.builtin.mk.
The loop to include all of the builtin.mk files needed by the package
is moved from bsd.builtin.mk and into bsd.buildlink3.mk. bsd.builtin.mk
is now included by each of the individual builtin.mk files and provides
some common logic for all of the builtin.mk files. Currently, this
includes the computation for whether the native or pkgsrc version of
the package is preferred. This causes USE_BUILTIN.* to be correctly
set when one builtin.mk file includes another.
The second major change is teach the builtin.mk files to consider
files under ${LOCALBASE} to be from pkgsrc-controlled packages. Most
of the builtin.mk files test for the presence of built-in software by
checking for the existence of certain files, e.g. <pthread.h>, and we
now assume that if that file is under ${LOCALBASE}, then it must be
from pkgsrc. This modification is a nod toward LOCALBASE=/usr. The
exceptions to this new check are the X11 distribution packages, which
are handled specially as noted below.
The third major change is providing builtin.mk and version.mk files
for each of the X11 distribution packages in pkgsrc. The builtin.mk
file can detect whether the native X11 distribution is the same as
the one provided by pkgsrc, and the version.mk file computes the
version of the X11 distribution package, whether it's built-in or not.
The fourth major change is that the buildlink3.mk files for X11 packages
that install parts which are part of X11 distribution packages, e.g.
Xpm, Xcursor, etc., now use imake to query the X11 distribution for
whether the software is already provided by the X11 distribution.
This is more accurate than grepping for a symbol name in the imake
config files. Using imake required sprinkling various builtin-imake.mk
helper files into pkgsrc directories. These files are used as input
to imake since imake can't use stdin for that purpose.
The fifth major change is in how packages note that they use X11.
Instead of setting USE_X11, package Makefiles should now include
x11.buildlink3.mk instead. This causes the X11 package buildlink3
and builtin logic to be executed at the correct place for buildlink3.mk
and builtin.mk files that previously set USE_X11, and fixes packages
that relied on buildlink3.mk files to implicitly note that X11 is
needed. Package buildlink3.mk should also include x11.buildlink3.mk
when linking against the package libraries requires also linking
against the X11 libraries. Where it was obvious, redundant inclusions
of x11.buildlink3.mk have been removed.
* Bugs for detecting ALi chipset fixed.
* Further smoothing for plotting curves in xmbmon.
* SMBus accesses of VIA VT8237 and Intel ICH6 are supported.
* Problem related to select() system call fixed (by Tsuneyuki Sakano).
* The part of IO port read/write is unified into an gas in-line
assembler code (so, gcc with x86-gas is assumed!); a contribution
by John Wehle (john@feith.com).
* Changes to work on Solaris for x86 platform and others for
cleaning up the codes, contributed by John Wehle (john@feith.com).
* Others: Fixing small bugs.
patch provided by Sergio Jimenez in PR 26356
* The modified BSD license is set from this version.
* Logging facility in the daemon mode is included (but unabled
in default, contribution by David Quattlebaum ).
* IIR low path filter smoothing method is included for plotting
graphs in xmbmon (contribution by Takayuki Hosoda).
* Manual files are contributed by Nicolas Rueff .
* Winbond W83791D, W83627THF chips are supported.
* Initialization of ADM9240 chip for some Intel motherboards
(by Alex Vasylenko).
* SMBus access of ALI1533/1543 chipset (Aladdin IV, V)
is supported.
* ISA access of 2nd and 3rd temperatures for Winbond chips fails
in most of motherboard. Due to this problem, fraction of these
temperatures is always 0.5. This "bug" is fixed now.
* Others: Fixing small bugs.
"""
Patch for fixing a long standing bug in xmbmon version 2.00-2.03
(April 7, 2004): here; this is for 2nd and 3rd temperatures in Winbond
chips with ISA access (no problem with SMBus access).
"""
Bump both mbmon's/xmbmon's PKGREVISIONs to 1.
changes since 2.01:
* Genesys Logic GL512SM and GL520SM sensors are supported.
* Intel ICH5 SMBus access supported.
* LM85, Analog Devices ADM1024/1025/1027/ADT7463,
and SMSC EMC6D10X sensors are supported.
* Analog Devices ADM1020/1021/1023 temperature sensors are supported.
* A log standing bug from version 2.00 in the treatment of
fan-divisor for the IT87xxF sensor chip is fixed.
* NetBSD/OpenBSD support is added (by a contribution of a patch
given by Stephan Eisvogel). "./configure; make" just works.
* The AMD8111 and NVidia nForce2 SMBus access is supported
(by information from Alex van Kaam).
* National Semiconductor LM90 temperature sensor is supported.
* Winbond W83L784R, W83L785R, W83L785TS-S sensors are supported.
* The case of two sensor chips are supported.
* Others: Fixing small bugs, clean-up the code.
